![]() Improved direct and indirect branch predictors.Each entry is now able to store up to two branch targets, provided that the first branch is a conditional branch and the second branch is located within the same aligned 64-byte cache line as the first one. L1 Branch Target Buffer (BTB) size increased by 50%, to 1.5K entries.Other features and improvements, compared to Zen 3, include: This translates to up to one 512-bit load per cycle or one 512-bit store per two cycles. Load and store units are also 256 bits each, retaining the throughput of up to two 256-bit loads or one store per cycle that was supported by Zen 3. The maximum number of instructions per clock cycle is doubled for vectors of 256 bits or less. There are four 256-bit execution units, which gives a maximum throughput of two 512-bit vector instructions per clock cycle, e.g. The two halves execute in parallel on a pair of execution units and are still tracked as a single micro-OP (except for stores), which means the execution latency isn't doubled compared to 256-bit vector instructions. Most 512-bit vector instructions are split in two and executed by the 256-bit SIMD execution units internally. Zen 4 is the first AMD microarchitecture to support AVX-512 instruction set extension. Finally, 4 PCIe 5.0 lanes are reserved for connecting the south bridge chip or chipset. Whether the lanes connecting the GPUs in the mechanical x16 slots are executed as PCIe 4.0 or PCIe 5.0 can be configured by the mainboard manufacturers. Additionally, there are now 2 x 4 lane PCIe interfaces, most often used for M.2 storage devices. ![]() This means that a discrete GPU can be connected by 16 PCIe lanes or two GPUs by 8 PCIe lanes each. Īll Ryzen desktop processors feature 28 (24 + 4) PCIe 5.0 lanes. However, XMP memory profiles are still supported. It allows to encode a wider set of timings to achieve better performance and compatibility. Unlike Intel XMP, AMD EXPO is marketed as an open, license and royalty-free standard for describing memory kit parameters, such as operating frequency, timings and voltages. Additionally, Zen 4 supports new AMD EXPO SPD profiles for more comprehensive memory tuning and overclocking by the RAM manufacturers. On desktop and server platforms, Zen 4 supports only DDR5 memory, with support for DDR4 dropped. Zen 4 marks the first utilization of the 5 nm process for x86-based desktop processors. Zen 4's I/O die includes integrated RDNA 2 graphics for the first time on any Zen architecture. Previously, the I/O die on Zen 3 was built on GlobalFoundries' 14 nm process for EPYC and 12 nm process for Ryzen. ![]() Like its predecessor, Zen 4 in its Desktop Ryzen variants features one or two Core Complex Dies (CCDs) built on TSMC's 5 nm process and one I/O die built on 6 nm. Zen 4 powers Ryzen 7000 mainstream desktop processors (codenamed "Raphael") and is used in high-end mobile processors (codenamed "Dragon Range"), thin & light mobile processors (codenamed "Phoenix"), as well as EPYC 9004 server processors (codenamed "Genoa" and "Bergamo"). It is the successor to Zen 3 and uses TSMC's N5 process for CCDs. Zen 4 is the codename for a CPU microarchitecture designed by AMD, released on September 27, 2022.
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